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Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217°C Melting Point, T4 Particle (200g)
4.0 (120 items)
Limited Time SaleUntil the end
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29
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US$22.19 cheaper than the new price!!
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Used US$14.80
Product details
| Management number | 209981343 | Release Date | 2026/04/02 | List Price | US$14.80 | Model Number | 209981343 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Premium SAC0307 Alloy - Sn99/Ag0.3/Cu0.7 Composition Ensures Strong Welding Joints And Oxidation Resistance.
- Low-Temp Melting At 217°C - Prevents Pcb And Component Damage During Soldering.
- T4 Fine Particle Size (20-38μm) - Ideal For Precision Stencil Printing And Mini-Component Soldering.
- No-Clean Flux Residue - Non-Corrosive, Non-Conductive, And Requires No Post-Cleaning.
- Wide Applications - Suitable For BGA, SMT and PCB Repairs In Consumer Electronics.
| Item Weight | 5 ounces |
|---|---|
| Manufacturer | WIVIE |
| Power Source | fuel_powered |
| Item model number | 200g |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 2.8 x 2.65 x 2.35 inches |
| Included Components | solder paste |
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